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| Freescale Semiconductor Technical Data MPVZ2202 Rev 0, 09/2006 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors The MPVZ2202 device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching and respiratory equipment. Features * Temperature Compensated Over 0C to +85C * Easy-to-Use Chip Carrier Package Options * Increased media compatibility fluorocarbon gel Typical Applications * Pump/Motor Controllers * Robotics * Level Indicators * Medical Diagnostics * Pressure Switching * Respiratory Equipment MPVZ2202 SERIES 0 TO 200 kPA (0 TO 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGE SURFACE MOUNT MPVZ2202GC6T1 CASE 482A-01 MPVZ2202GC7U CASE 482C-03 SMALL OUTLINE PACKAGE PIN NUMBERS 1 GND(1) +VOUT VS VS 5 6 7 8 N/C N/C N/C N/C ORDERING INFORMATION Device Type Options Case No. 482A 482C MPX Series Order No. Packing Options Device Marking MPVZ2202G MPVZ2202G 2 3 4 SMALL OUTLINE PACKAGE (MPVZ2202 SERIES) Ported Gauge, Vertical Port, Elements Surface Mount Gauge, Vertical Port, Through Hole MPVZ2202GC6T1 Tape and Reel MPVZ2202GC7U Tube 1. Pin 1 is noted by the notch in the lead. (c) Freescale Semiconductor, Inc., 2006. All rights reserved. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation And Calibration Circuitry 1 GND Sensing Element 2V out+ 4V out- Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 800 -40 to +125 -40 to +125 Unit kPa C C (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPVZ2202 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristics Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 200 kPa) Temperature Hysteresis(5) (-40C to +125C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: * * * * Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. MPVZ2202D Serie Symbol POP VS Io VFSS Voff V/P -- -- -- TCVFSS TCVoff Zin Zout tR -- -- Min 0 -- -- 38.5 -1.0 -- -0.6 -- -- -2.0 -1.0 1000 1400 -- -- -- Typ -- 10 6.0 40 -- 0.2 -- 0.1 0.5 -- -- -- -- 1.0 20 0.5 Max 200 16 -- 41.5 1.0 -- 0.4 -- -- 2.0 1.0 2500 3000 -- -- -- Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV W W ms ms %VFSS 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPVZ2202 Sensors Freescale Semiconductor 3 LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Relative Voltage Output Least Square Deviation Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Fullscale) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the output characteristics of the MPVZ2202 series at 25xC. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. 40 35 30 25 Output (mVdc) 20 15 10 5 0 kPa PSI -5 0 VS = 10 Vdc TA = 25C P1 > P2 TYP Span Range (TYP) MIN MAX 25 50 7.25 75 100 14.5 Pressure 125 150 21.75 175 200 29 Offset (TYP) Figure 3. Output versus Pressure Differential MPVZ2202 4 Sensors Freescale Semiconductor Gel Die Coat P1 Wire Bond Die Stainless Steel Cap Thermoplastic Case Lead Frame P2 Differential Sensing Element Die Bond Figure 4. Cross-Sectional Diagram (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number MPVZ2202GC6T1 MPVZ2202GC7U Case Type 482A 482C Pressure (P1) Side Identifier Top with Port Attached Top with Port Attached MPVZ2202 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -A- 4 5 D 8 PL 0.25 (0.010) M TB S A S N -B- G 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -T- SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE -A- 4 5 N -B- G 8 1 0.25 (0.010) M TB D 8 PL SA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 DETAIL X S W V C PIN 1 IDENTIFIER -T- K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ2202 6 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved. MPVZ2202 Rev. 0 09/2006 |
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